SK Hynix plans to further expand HBM4 production capacity, with a target to increase HBM output by 20,000 units per month.

According to South Korea’s Electronic News, SK Hynix plans to further expand production capacity of its fourth-generation High Bandwidth Memory (HBM4). Multiple sources from semiconductor equipment firms told reporters on November 15 that SK Hynix is in talks with partners to place orders for HBM4 production equipment, primarily coordinating procurement timelines and volumes with suppliers handling HBM back-end processes including bonding, dicing, and inspection. A source close to one of SK Hynix’s suppliers stated: “SK Hynix is advancing additional investments in HBM4 production equipment, aiming to complete equipment delivery, on-site setup, and commissioning in the first half of next year, and is accelerating relevant arrangements.” The company has required some equipment to be delivered no later than the first quarter of next year, signaling the expansion plan is moving at a rapid pace. The new capacity will mainly be deployed at SK Hynix’s P&T6 plant in Cheongju, South Korea. Formerly called M8, the facility was selected as SK Hynix’s HBM production base in 2025, with HBM line construction starting there earlier this year. The additional expansion means the company plans to further ramp up HBM4 capacity, with progress potentially ahead of the original schedule. Another industry insider added: “The company intends to maximize idle space at the P&T6 plant to boost HBM4 capacity. If the entire facility is fully operational, it could add over 20,000 HBM wafers per month.”