1inch Team Denies Official Sell-off of Token Yesterday Leading to Price Drop, Plans to Review Tokenomics Later This Year

SK Hynix (SKHY) posted third-quarter revenue of 104.6 trillion Korean won, above the market consensus of 98.3 trillion won. The company’s Q3 net profit stood at 39.5 trillion won, missing the market forecast of 55.4 trillion won, while operating profit hit 83.3 trillion won, beating the 76.7 trillion won expectation.

SK Hynix plans to return approximately 100 trillion won to shareholders by 2026. The company intends to offer over 30 trillion won in cash dividends, repurchase and retire more than 60 trillion won worth of its own shares, and distribute a quarterly cash dividend of 20,000 won per share in the third quarter.

According to data from the BIT Stock Platform, U.S. stocks closed on Tuesday (October 27), with the Dow Jones Industrial Average rising 0.03%, the S&P 500 gaining 0.60%, and the Nasdaq Composite advancing 1.18%. Neocloud-related stocks rallied across the board: Nebius (NBIS) jumped 11.22%, Cipher Digital (CIFR) rose 9.99%, Galaxy Digital (GLXY) gained 9.57%, Applied Digital (APLD) climbed 9.42%, CoreWeave (CRWV) advanced 7.94%, and IREN increased 7.90%. Most optical communication concept stocks strengthened: Credo (CRDO) surged 10.77%, Astera Labs (ALAB) rose 10.47%, Applied Optoelectronics (AAOI) gained 6.96%, Coherent (COHR) climbed 6.38%, and Lumentum (LITE) advanced 5.88%. Storage stocks rallied across the board: Western Digital (WDC) rose 6.95%, SanDisk (SNDK) gained 3.92%, Seagate Technology (STX) advanced 3.67%, Micron Technology (MU) climbed 2.77%, and SK Hynix (SKHY) increased 1.92%. Semiconductor stocks also moved higher in tandem: AMD rose 5.45%, Marvell Technology (MRVL) gained 4.19%, Broadcom (AVGO) advanced 4.00%, Intel (INTC) climbed 3.61%, and both TSMC (TSM) and ASML rose 2.94%.

SK Hynix stated that the average selling price (ASP) of DRAM in the third quarter rose by over 20% quarter-on-quarter. It projects that DRAM market demand will grow by more than 20% year-on-year in 2027, and capital expenditure in 2027 will increase significantly compared to 2026. Long-term agreements (LTAs) for 2027 and 2028 have locked in supply volumes exceeding 50% of total production capacity.

Cancore, a trading platform built on the Canton Network, has closed a $7.2 million seed funding round. The platform is designed to bridge assets on the Canton Network with liquidity on public blockchains. Participating in the round are Paper Ventures, dao5, ArkStream Capital, X Ventures, MH Ventures, and Proof of Talk. Wasif Rashid, co-founder and CEO of Cancore, stated that no formal lead investor was named in the round, though Paper Ventures and dao5 secured the largest allocations. The funding was executed via a Simple Agreement for Future Tokens (SAFT), with a fully diluted valuation of $60 million corresponding to Cancore’s planned CNRX token issuance, Rashid added.

According to a Reuters report, Moody’s Ratings said Tuesday that massive borrowing to fund artificial intelligence (AI) infrastructure is pushing the private credit sector beyond traditional corporate lending. However, a large volume of loans will mature in the coming years, leaving weaker borrowers facing potential refinancing difficulties. Specifically, AI financing needs have expanded beyond data center construction to areas including land, power, semiconductors, graphics processing units (GPUs), and tensor processing units (TPUs). Moody’s projects that total capital expenditures of the U.S.’s five largest hyperscale cloud service providers and CoreWeave will reach nearly $1 trillion by 2027, with funding sources including operating cash flow, debt, and financing structures such as joint ventures and special purpose vehicles (SPVs). Moody’s warned that loans maturing between 2027 and 2029 will test weaker borrowers’ ability to refinance amid higher interest rates. Of the 607 borrowing firms tracked by Moody’s, around 17% use payment-in-kind (PIK) interest—a practice that defers cash interest payments and adds accrued interest to debt, further increasing their debt burden. Additionally, Moody’s flagged risks related to “circular financing”: as cross-investments, lending, and procurement between tech firms, chipmakers, and AI developers grow, these interconnected exposures could deteriorate simultaneously if the industry enters a downturn.