Elon Musk comments on the sell-off of memory chip stocks: After China mastered the manufacturing technology, its production expansion capacity often exceeds that of the rest of the world combined.

Amid the sell-off of memory chip stocks, Elon Musk posted remarks that once China masters the manufacturing technology of a product, its capacity to scale production often exceeds that of the rest of the world combined—a trend already observed in the lithium battery and solar sectors. He noted that the memory industry may be an exception, but roughly three years ago, memory was still a low-margin commodity. LP5 and LP6 follow universal standards, and China appears to be rapidly mastering the relevant technologies. However, next-generation HBM architectures, as well as technologies such as placing an SRAM layer beneath logic circuits, 3D-stacking memory on top, and resolving logic circuit heat dissipation simultaneously, will be far more challenging to master. Musk also said SpaceX is a rare counterexample, with its total mass of payloads sent to orbit roughly an order of magnitude higher than that of the rest of the world combined. However, of the total mass of payloads sent to orbit excluding SpaceX, China accounts for the majority. Previous reports noted that Changxin Technology announced key progress in the development of the next-generation DRAM 4F² architecture, and is expected to launch DDR5 RDIMM server memory products integrating this architecture and technologies like hybrid bonding by the end of the year. Compared with the mainstream 6F² architecture, the 4F² theoretically reduces cell area by about one-third, boosts storage density by roughly 50% at the same wafer area and process node, stoking market concerns over future competition and supply expansion.