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Samsung Electronics submits latest HBM patent to solve reliability challenges of high-stacked memory.

2026.06.30 18:47:10

Citrini researcher Jukan has revealed that Samsung Electronics has filed a new HBM patent, which addresses reliability challenges of high-stacked (12+ layers) memory by improving the structure of the topmost dummy die. The patent’s core design features a three-step stepped plus convex curved surface on the dummy die’s side, adopting a deep trench sawing process to reduce warpage, cracks and delamination, while optimizing thermal management and bonding interface cleanliness. Targeting 16+ layer products like HBM5, this innovation can notably boost yield and long-term stability, helping Samsung strengthen its competitiveness in the AI high-bandwidth memory market.

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