10 #Bitcoin ETFs outflows 2,152 $BTC(-$201.21M) and 9 #Ethereum ETFs outflows 45,684 $ETH(-$148.11M) yesterday.

Samsung Electronics has begun constructing a Die-to-Wafer (D2W) hybrid bonding production line at its Pyeongtaek P5 plant, targeting advanced packaging for next-generation HBM and logic semiconductors. Dutch firm Besi is the preferred core equipment supplier, with Samsung planning to procure around 50 hybrid bonding machines—each priced at approximately 6 billion won (about $4.3 million), twice the cost of competing products. However, negotiations have moved slowly due to Samsung’s demand for custom modifications to the equipment architecture, and Besi, which also supplies TSMC and Micron, is cautious about modifying machines exclusively for Samsung. Samsung is also considering local alternatives: its subsidiary SEMES has completed development of D2W hybrid bonding machines and delivered samples for validation earlier this year; Hanwha Semitech finished developing its second-generation "SHB2 Nano" in February, and sent samples to SK Hynix in April. Its cluster system integrating EFEM, plasma activation, and cleaning modules gives it a differentiated competitive edge. This technology uses hybrid copper bonding to replace traditional thermocompression bonding, enabling direct bonding of copper and dielectric materials and drastically shortening interconnect lengths. Its core application is custom HBM: vertically stacking HBM DRAM layers directly on logic dies that include customers’ computing circuits and IP to form 3D system-in-package (SiP). Citrini analyst Jukan noted that hybrid bonding is expected to be used in NVIDIA’s next-generation AI accelerator Feynman, which will adopt custom HBM, and the technology’s rollout timeline "has been pushed back from HBM4E". Samsung’s internal projections indicate large-scale application will not be realized until around 2029-2030, a timeline that aligns with NVIDIA’s expected window for Feynman.

Since its launch less than three weeks ago, Robinhood Chain has attracted $431 million in total value locked (TVL) and more than 250,000 daily active users. To date, meme token trading has accounted for over 80% of its $9 billion in decentralized exchange (DEX) volume. However, FalconX stated that tokenized real-world assets (RWAs) could be a key driver of Robinhood Chain’s future activity.

According to BIT (bit.com) market data, US pre-market optical communication concept stocks are generally rising. Specifically: Pure Photonics ETF (FOTO) gains 3.81%; Marvell Technology (MRVL) rises 6.24%; AAOI (Applied Optoelectronics) climbs 5.07%; LITE (Lumentum Holdings) increases 5.15%; COHR (Coherent Corp.) is up 5.23%; CIEN (Ciena Corporation) gains 3.94%.

The 2026 FIFA World Cup has emerged as a watershed moment for the prediction market industry. According to statistics from BlockBeats, Kalshi’s total platform trading volume during the World Cup reached $54.338 billion, roughly 2.6 times Polymarket’s $20.988 billion. World Cup-related event trading volume stood at $13.591 billion, around 31% higher than Polymarket’s $10.356 billion. In terms of user growth, Kalshi’s app downloads hit 5.368 million, far outpacing Polymarket’s 2.136 million. The exposure effect of Kalshi’s stadium sideline ads is widely viewed as a key driver behind its widening lead. While Polymarket leads in website traffic with 57.44 million visits, it failed to translate this into equivalent advantages in trading volume and app downloads. For other platforms: Predict.fun recorded total trading volume of $1.092 billion, with World Cup-related volume at $886 million; Opinion’s total volume was $1.137 billion, of which World Cup-related activity was approximately $561 million; Limitless had total volume of $446 million, with World Cup-related volume around $220 million. From the data landscape, Kalshi and Polymarket have formed a duopoly, together accounting for over 95% of the total market share. Smaller platforms still face an order-of-magnitude gap in absolute scale. The World Cup’s "Super Bowl effect" on prediction markets is pronounced—during the event, industry concentration further increased, and brand exposure and user acquisition efficiency are becoming core variables shaping the next stage of the competitive landscape.

Samsung Electronics has commenced construction of a Die-to-Wafer (D2W) hybrid bonding production line at its P5 plant in Pyeongtaek, targeting advanced packaging for next-generation High Bandwidth Memory (HBM) and logic semiconductors. Samsung’s top pick for core equipment suppliers is Dutch firm Besi; the company plans to procure around 50 hybrid bonding machines, each priced at roughly 6 billion won (about $4.3 million) — twice the cost of competing products. However, negotiations have moved slowly due to Samsung’s demand for custom modifications to the machine architecture, and Besi, which also supplies TSMC and Micron, is cautious about modifying equipment exclusively for Samsung. Samsung is simultaneously evaluating local alternatives: its subsidiary SEMES has completed development of D2W hybrid bonding machines and delivered samples for validation earlier this year. Hanwha Semitech finished developing its second-generation "SHB2 Nano" in February, and sent samples to SK Hynix in April. Its cluster system integrating Equipment Front End Module (EFEM), plasma activation, and cleaning modules offers distinct competitive advantages. This technology replaces traditional thermocompression bonding with hybrid copper bonding, enabling direct bonding of copper and dielectric materials and drastically shortening interconnect lengths. Its core application is custom HBM: vertically stacking HBM DRAM layers directly on logic dies containing customers’ computing circuits and intellectual property (IP) to form 3D system-in-package (SiP) solutions. Citrini analyst Jukan stated that hybrid bonding is expected to be used in NVIDIA’s next-generation AI accelerator Feynman, which will adopt custom HBM, with the technology’s deployment timeline "pushed back from HBM4E". Samsung’s internal projections indicate large-scale commercialization will not be achieved until around 2029–2030, a timeline that aligns with NVIDIA’s expected window for Feynman.

According to the Financial Times, US President Donald Trump will impose new tariffs on dozens of countries as early as this week.