SK Hynix and SanDisk Release the First Standard Specification for HBF

ON Semiconductor projects third-quarter revenue between $1.65 billion and $1.75 billion, exceeding analyst expectations, driven by surging demand for AI data center chips. The company also announced a $7 billion all-stock acquisition of Synaptics to expand into AI devices and robotics.

According to on-chain analyst Yu Jin’s monitoring, two addresses suspected to belong to a16z transferred 979,000 HYPE tokens to Hyperliquid for staking 8 hours ago, with a value of approximately $53.53 million.

South Korean Finance Minister Koo Yoon-cheol said Tuesday at a cabinet meeting that he will work to ease volatility in South Korea's stock market. He also added that the Ministry of Finance will swiftly implement recently announced measures to restrict the use of single-stock leveraged ETFs.

Snap reported second-quarter revenue of $1.6 billion, up roughly 19% year-over-year and beating market expectations, driven mainly by World Cup ad spending and stronger activities from key North American clients. According to market data from BIT (bit.com), its after-hours share price surged 13% at one point. CEO Evan Spiegel sidestepped questions about pre-order demand for the Specs smart glasses—priced at $2,195 and set to launch in Los Angeles on September 16. The company’s daily active users (DAUs) rose to 493 million, though user counts in North America and Europe declined.

NTT Data plans to invest at least $9 billion (approximately 1.5 trillion yen) by 2033 to raise Japan’s data center computing capacity to 1 gigawatt, adding around 750 megawatts to meet AI demand. The firm, Japan’s largest data center operator, may adjust the investment scale based on price and demand fluctuations, with costs for AI accelerators such as NVIDIA excluded. This move underscores intense competition and supply tightness in Japan’s AI infrastructure.

According to Reuters, people familiar with the matter said that Changxin Memory Technologies is considering building a second 12-inch DRAM fab in Beijing’s Yizhuang district, and is in talks with the Beijing Economic-Technological Development Area (BDA) and several state-owned tech firms for financing. The company is seeking at least 60 million yuan (about $8.9 million) in support, but negotiations are still in the early stages, and the financing scale and structure may be adjusted. The planned fab will be located on the site of Changxin’s existing DRAM fab in Beijing. The project’s planned production capacity and total investment have not been finalized, while building a fab capable of manufacturing advanced DRAM typically requires more than $10 billion. Currently, Changxin operates two 12-inch DRAM fabs in Hefei and one in Beijing, each with a monthly production capacity of about 100,000 wafers. The company is also constructing new fabs in Shanghai and Hefei; once these projects are fully operational, its monthly production capacity could double to over 600,000 wafers. The expansion comes as demand for storage chips enters an upward cycle, driven by AI infrastructure, data centers and consumer electronics. Last month, Changxin completed an $8.6 billion IPO, the largest semiconductor listing on the Chinese mainland, and its share price has risen 13% since the debut. Changxin is currently the world’s fourth-largest DRAM manufacturer, but Samsung Electronics, SK Hynix and Micron still held a combined nearly 90% of the global market share in the first quarter. Beijing and Shanghai are also providing financing and other support to Changxin to capture the economic and strategic benefits brought by its expansion.