Citrini’s view: Korean manufacturers hold a cautious stance on the commercialization of 3D IC, while China’s ChangXin Memory Technologies is accelerating to secure niche markets via a customized approach.

Citrini analyst Jukan, citing the latest industry analysis from ZDNet Korea, notes that the AI semiconductor performance race is shifting from process miniaturization to advanced stacking technology, with 3D ICs—vertically integrating logic and memory—emerging as a key next-generation technology. Samsung Foundry has recently seen a sharp surge in inquiries for 3D ICs, with nearly every potential client asking about the technology. However, Jukan argues that 3D ICs are essentially custom DRAMs built to order, which fundamentally conflicts with the core business models of Samsung and SK Hynix, both relying on mass-producing standardized products. The two Korean giants are expected to limit their involvement to preliminary research and remain cautious about full commercialization. This structural hesitation opens an opportunity for niche players. China’s ChangXin Memory Technologies (CXMT), barred from entering the HBM market due to U.S. semiconductor restrictions, is leveraging 3D ICs as a differentiating breakthrough, choosing to target custom memory instead of competing head-on with Korean firms in the bulk DRAM segment. A South Korean semiconductor industry official stated that China has taken the lead in producing multiple 3D DRAM sample chips, and niche market players like CXMT and Winbond are likely to be the first to build this market. Analyst Jukan has also previously emphasized that NVIDIA’s CUDA moat is ending: the erosion of its software ecosystem barrier is occurring in tandem with the trend of 3D IC customization, and the next-generation AI memory competitive landscape may face a structural reshuffle.